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fedr27v402e-02-02 1 semiconductor this version : jun. 2001 previous version: jan. 2001 mr27v402e 262,144?word 16?bit or 524,288?word 8?bit production programmed read only memory (p2rom) 1/11 general description the mr27v402e is a 4 mbit production programmed read-only memory (p2rom ) that can be electrically switched between 262,144-word 16-bit and 524,288-word 8-bit by the state of the byte pin. the mr27v402e supports high speed asynchronous read operation using a single 3.3v power supply. features 262,144-word 16-bit/524,288-word 8-bit electrically switchable configuration +3.3 v power supply access time 70 ns max operating current 30 ma max standby current 50 a max input/output ttl compatible three-state output packages: 40-pin plastic dip (dip40-p-600-2.54) (product name : mr27v402e-xxxrp) 40-pin plastic sop (sop40-p-525-1.27-k) (product name : mr27v402e-xxxmp) 44-pin plastic tsop (tsop(2)44-p-400-0.80-k) (product name : mr27v402e- xxxtp)
fedr27v402e-02-02 1 semiconductor mr27v402e 2/11 pin configuration (top view) pin name functions d15/a?1 data output / address input a0 to a17 address input d0 to d14 data output ce chip enable oe output enable byte mode switch v cc power supply voltage v ss gnd nc non connection 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 nc nc a8 a9 a10 a11 a12 a13 a14 a15 a16 byte v ss d15/a?1 d7 d14 d6 d13 d5 d12 d4 v cc nc nc a17 a7 a6 a5 a4 a3 a2 a1 a0 ce v ss oe d0 d8 d1 d9 d2 d10 d3 d11 44- p in tsop ( ii ) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 a8 a9 a10 a11 a12 a13 a14 a15 a16 byte v ss d15/a?1 d7 d14 d6 d13 d5 d12 d4 v cc a17 a7 a6 a5 a4 a3 a2 a1 a0 ce v ss oe d0 d8 d1 d9 d2 d10 d3 d11 40- p in dip or sop
fedr27v402e-02-02 1 semiconductor mr27v402e 3/11 block diagram function table mode ce oe byte v cc d0 to d7 d8 to d14 d15/a?1 read (16-bit) l l h d out read (8-bit) l l l d out hi?z l/h h output disable l h l hi?z ? h standby h ? l 3.3 v hi?z ? ? : don?t care (h or l) a0 a1 a2 a3 a4 a5 a6 a7 a8 a9 a10 a11 a12 a13 a14 a15 a16 a17 ce byte oe ce oe 8/ 16 switch d0 d2 d4 d6 d8 d10 d12 d14 d1 d3 d5 d7 d9 d11 d13 d15 memory cell matrix 262,144 16-bit or 524,288 8-bit multiplexer output buffer row decoder column decoder address buffer in 8-bit output mode, these pins are placed in a high-z state and pin d15 functions as the a-1 address pin. a?1
fedr27v402e-02-02 1 semiconductor mr27v402e 4/11 absolute maximum ratings parameter symbol condition value unit operating temperature under bias ta 0 to 70 c storage temperature tstg ? ?55 to 125 c input voltage v i ?0.5 to v cc +0.5 v output voltage v o ?0.5 to v cc +0.5 v power supply voltage v cc relative to v ss ?0.5 to 5 v power dissipation per package p d ?1.0w recommended operating conditions (ta = 0 to 70c) parameter symbol condition min. typ. max. unit v cc power supply voltage v cc 3.0 ? 3.6 v input ?h? level v ih 2.2 ? v cc +0.5 ? v input ?l? level v il v cc = 3.0 to 3.6 v ?0.5 ?? ?0.6 v voltage is relative to v ss . ? : vcc+1.5v(max.) when pulse width of overshoot is less than 10ns. ?? : -1.5v(min.) when pulse width of undershoot is less than 10ns.
fedr27v402e-02-02 1 semiconductor mr27v402e 5/11 electrical characteristics dc characteristics (v cc = 3.3 v 0.3 v, ta = 0 to 70c) parameter symbol condition min. typ. max. unit input leakage current i li v i = 0 to v cc ??10 a output leakage current i lo v o = 0 to v cc ??10 a i ccsc ce = v cc ??50 a v cc power supply current (standby) i ccst ce = v ih ?? 1m v cc power supply current (read) i cca ce = v il , oe = v ih tc = 70 ns ??30ma input ?h? level v ih ?2.2?v cc +0.5 ? v input ?l? level v il ? ?0.5 ?? ?0.6 v output ?h? level v oh i oh = ?2 ma 2.4 ? ? v output ?l? level v ol i ol = 2.1 ma ? ? 0.4 v voltage is relative to v ss . ? : vcc+1.5v(max.) when pulse width of overshoot is less than 10ns. ?? : -1.5v(min.) when pulse width of undershoot is less than 10ns. ac characteristics (v cc = 3.3 v 0.3 v, ta = 0 to 70c) parameter symbol condition min. max. unit address cycle time t c ?70?ns address access time t acc ce = oe = v il ?70ns ce access time t ce oe = v il ?70ns oe access time t oe ce = v il ?30ns t chz oe = v il 030ns output disable time t ohz ce = v il 025ns output hold time t oh ce = oe = v il 0?ns measurement conditions input signal level-------------------------------- 0 v/3 v input timing reference level ------------------ 0.8 v/2.0 v output load -------------------------------------- 50 pf output timing reference level---------------- 0.8 v/2.0 v output 2.08 v 800 ? 50 pf (including scope and jig)
fedr27v402e-02-02 1 semiconductor mr27v402e 6/11 timing chart (read cycle) 16-bit read mode ( byte = v ih ) address ce oe d0 to d15 t c t ce t oe t oh t chz t ohz valid data hi-z hi-z t oh t acc valid data t acc t c 8-bit read mode ( byte = v il ) address ce oe d0 to d7 t c t ce t oe t oh t chz t ohz valid data hi-z hi-z t oh t acc valid data t acc t c
fedr27v402e-02-02 1 semiconductor mr27v402e 7/11 pin capacitance (v cc = 3.3 v, ta = 25c, f = 1 mhz) parameter symbol condition min. typ. max. unit input c in1 ? ? 8(10) byte c in2 v i = 0 v ? ? 120 output c out v o = 0 v ? ? 10(12) pf ( ) : dip only
fedr27v402e-02-02 1 semiconductor mr27v402e 8/11 package dimensions dip40-p-600-2.54 package material epoxy resin lead frame material 42 alloy pin treatment solder plating ( 5m) package weight (g) 6.10 typ. 5 rev. no./last revised 2/dec. 11, 1996 (unit: mm)
fedr27v402e-02-02 1 semiconductor mr27v402e 9/11 sop40-p-525-1.27-k mirror finish package material epoxy resin lead frame material 42 alloy pin treatment solder plating ( 5m) package weight (g) 1.27 typ. 5 rev. no./last revised 3/oct. 21, 1996 notes for mounting the surface mount type package the surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact oki?s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). ( unit: mm )
fedr27v402e-02-02 1 semiconductor mr27v402e 10/11 tsop(2)44-p-400-0.80-k mirror finish package material epoxy resin lead frame material 42 alloy pin treatment solder plating ( 5m) package weight (g) 0.54 typ. 5 rev. no./last revised 3/dec. 10, 1996 notes for mounting the surface mount type package the surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact oki?s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (unit: mm)
fedr27v402e-02-02 1 semiconductor mr27v402e 11/11 notice 1. the information contained herein can change without notice owing to product and/or technical improvements. before using the product, please make sure that the information being referred to is up-to-date. 2. the outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. when planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. when designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. neither indemnity against nor license of a third party?s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. no responsibility is assumed by us for any infringement of a third party?s right which may result from the use thereof. 6. the products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). these products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. certain products in this document may need government approval before they can be exported to particular countries. the purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. no part of the contents contained herein may be reprinted or reproduced without our prior permission. copyright 2001 oki electric industry co., ltd.

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